Surface Mount Technology

Controlled, Flexible and able to meet Technically Challenging SMT PCB Assembly

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Surface Mount Technology for PCB Assembly

Cogent Technology uses the latest Surface Mount Technology (SMT)  and advanced equipment giving us the ability to place 01005 components quickly and accurately allowing. Intelligent planning and a surfeit of feeder capacity heightens efficiency for produce both low and high volumes.

The cornerstone process of most products assembled at Cogent Technology our Surface Mount assembly capability has perpetually evolved over 30 years applying surface mount technology, updated to meet our changing customer needs, and will continue to do so.

Our surface mount line features the industry’s most outstanding equipment for flexible manufacture of complex SMT incorporating fine pitch, BGA, uBGA, CSP. The line features DEK screen printing, Mydata SMT, BTU reflow, Ersascope BGA inspection and UltraVision AOI.

Surface Mount Technology (SMT) Process

Challenging double sided mixed technology PCB assembly can be catered for with with either glue dot and wave or in concert with Selective Wave Surface Mount Soldering.

Speed and placement capability are complimented by an ability to perform rapid changeovers essential in a high mix Surface Mount service.

Rolling in process inspection ensures control and detailed analytics of Key performance indicators are reviewed within the SMT quality circle which meet regularly to build on our excellent yield data.


Please click here to download our Capability Statement