Cogent will select the right Through-Hole Assembly process to optimise quality and minimise costContact the Cogent Team
Cogent Technology offers a range of solutions for through-hole PCB assembly all compliant with IPC-A-610 workmanship standards.
Through-hole PCB Assembly Manufacturing Process
Whilst conventional manual through-hole soldering has a part to play at prototype and for very small volume, in concert with the efficiency of surface mount technology (SMT), Cogent seeks to apply the most efficient methodology available.
For high densities of mixed component through-hole insertion, laser guided Mascot assembly stations ensure consistent placement.
For maximum throughput of medium-high volume batches, slide line techniques are deployed with a culture of buddy checking, to build in quality.