Manufacturing Capabilities

Section A - Surface Mount

1. Solder Paste Application Equipment

   Type of solder printing machines:

   DEK Horizon 03i automatic in-line printing machine

   DEK265 automatic in-line printing machine

   Type of alignment requirements:

   Automatic fiducial align

   Solder paste used:

   62/36/2 (tin/lead), SAC387 (lead free)

   Type of flux used:

   No clean

   Type of screen used:

   Stainless steel

2. Adhesive Application Capability

   Type of dispensing machines:

   DIMA DD-500 Dispense Master

   Type of alignment requirements:

   Automatic fiducial align

   Glue dot sizes:

   0.3 - 2.0mm Dots

   Dispense line sizes:

   0.3 - 2.5mm wide lines

   Maximum PCB clearance/work height:

   87mm

   Dispensing media:

   SMT Adhesive, Epoxy, cyanoacrylate, etc adhesives

   Pealable masking, silicon sealant compounds, etc

3. Placement Capability

   Type of placement machines:

   Mydata MY9 (x2)

   Philips CSM Eclipse II

   Number of feeders per machine:

   Mydata MY9 – 192 x 8mm tape

   Philips Eclipse II – 100 x 8mm tape

   Finest pitch device placed:

   0.3mm (12thou) (capability for 0.16mm pitch)

   Smallest component placed:

   0402 (capability for 01005)

   Largest component placed:

   50mm² (32mm² on Philips)

   Alignment method used:

   On-the-fly Vision (Mydata)

   Laser and vision (Philips)

   BGA capabilities:

   BGA with 0.75mm pitch (min) x 50mm²

4. Soldering

   Type of reflow:

   Convection

   Type of machines:

   BTU VIP70A (Convection reflow)

   SMT 430C (Convection reflow)

   Minimum and Maximum PCB / Panel width:

   60 - 460mm

   Profiling equipment and Records:

   Datapaq 6 channel reflow profiler

Section B - Conventional

1. Soldering

   Type of Wave soldering machines:

   2 x Blundell CMS 400D

   Type of wave:

   Dual Wave

   Width of conveyor:

   400mm

   Type of solder used:

   63/37 (tin/lead), SACP0307 (lead free)

   Type of flux used:

   No Clean

   Method of fluxing:

   Spray

   Pre-heaters:

   Single zone & 2 zone Pre-heat tunnel

2. Manual Assembly

   Type of soldering irons, solder used:

   ERSA Digital 2000A, Pace ST45, Pace HW100/200

   Solder/flux used:

   No Clean Solder Wire

   Local cleaning:

   Isopropanol

   Build aids used:

   Slide Line Assembly Stations

   Mascot Laser Guided Assembly Stations

   Manual Assembly frames

   Lead cropping and clinching:

   Blundell Cropmatic

3. Component Forming Capabilities

   Type of forming machines:

   ITECO 7915/100, Elite Engineering F125 90deg crop & bend

   Smallest component formed at present:

   Body - 3 x 1.56mm Lead diameter - 0.8mm

   Largest component formed at present:

   Body - 10 x 6mm Lead diameter - 1.5mm

   Largest component capable of being formed:

   Body - 40 x 13mm Lead diameter - 1.5mm

   Component types which can be formed:

   Axial, Radial (lead crop only)

4. Tinning Capabilities

   Make of tinning machine:

   RS solder pot

   Component types which can be tinned:

   Used only for tinning wire ends

5. Cable Forming Capabilities

   Make of tinning machine:

   Artos CS-338 wire cut and strip machine

   Gamma T12 semi automatic crimping press.

   WDT SSC-2FP safety loose piece crimping press

   Wire types which can be cut/stripped:

   30 – 8 AWG (0.05 – 8mm²)

SECTION C

1. Conformal Coating Capabilities

   Type of coating:

   Humiseal 1H20 UR5

   SCH Technologies Epcryl150

   Application method:

   Spray (Humiseal & SCH) / Dipped (SCH)

   Drying method:

   Air

   Inspection Method:

   UV tracer in coating material

   Masking requirements:

   All electrical contact areas and any unsealed components (e.g. switches and pots)

2. Cable Over Moulding Capabilities

   Type of moulding machine:

   Optimel OM1200

   Moulding material:

   Henkel Macromelt OM646 (black polyamide)

   Moulding applications

   Over moulding of cables and PCB assemblies

SECTION D

1. Cleaning Capabilities

   Where possible we operate a ‘No Clean’ production process, but where customers require cleaning of their assemblies or Conformal Coating is required the following is employed.

   Type of machine:

   CC Hydrosonics Sensotronic AVD 400 SA

   Method of cleaning:

   Solvent Wash, Solvent Rinse

   Agitation method:

   Solvent pumped flow

   High frequency ultrasonics (can be disabled)

   Cleaning agent:

   Co-solvent: 3M HFE-71IPA, Topkleene EL20A

SECTION E

1. Rework Capabilities

   Type of equipment:

   ERSA IR550. (IR SMT rework)

   ERSA HS8000 Hot Air Pencils

   PACE MT-100 Rework tweezers

   PACE ST115 De-soldering Stations

2. Test Capabilities

   A full range of functional test services are available to meet customer requirements.

SECTION F

1. Quality Control Capabilities

   Type of inspection:

   Manual, AOI

   Magnification for visual inspection:

   X2, X4, X10, X20 and X40

   Equipment Used:

   DCB Automation Ultravision AOI System.

   Ersa Ersascope 2 BGA & CSP inspection system

   Vision Engineering Mantis, Microscopes and illuminated magnifiers, Force Systems Crimp Tester

   Software Tools:

   Tracking system: Controls progress of product through build process, including rework and customer returns, with traceability of operations and key materials, to provide a complete device history record

   Standards Adhered to:

   To meet all customer requirements, including:

   BS EN ISO9001:2008

   BS EN ISO13485:2003

   MIL STD 2000

   IPC-A-610D

2. Miscellaneous

   Workmanship capabilities:

   ANSI/J-STD-001B, MIL-STD-2000A, IPC-A-610D

   Drawing packages used:

   PADS Power PCB, CamCad, AutoCad LT, Controlled paper

   Procurement capabilities:

   Electronic components, PCB’s and mechanical piece parts, enclosures and packaging

   Anti-static precautions:

   Wrist, foot and floor

   Component storage conditions:

   Dry temperate store

   Environmental issues:

   No toxic materials normally used

   Despatch Packaging:

   Populated PCB’s in anti-static bags, and or anti-static bubble wrap as required

Rev 5 - June 2010